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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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| Sponsor |
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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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| Ask the Experts |
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November 5, 2006 - Updated
July 4, 2007 - Originally Posted
Is "Cost per placement" key factor
I've built a matrix for evaluating a new placement line. Should "Cost per Placement" be the key factor if all other specifications meet our needs?
D.G.
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| Expert Panel Responses |
Cost per placement is one factor, but total cost of ownership may be a better benchmark to use. Make sure all machines give you actual speeds for your test board, and give a money back guarantee that those speeds can be achieved. If you don't have a test board, use the IPC standard test board. Many suppliers have unfortunately returned to the days of grossly exaggerated "cycle rates". Be careful and make them all prove it.
Bob Black
North America Sales Manager
Essegi Automation
Mr. Black was the President and Co-Founder of Zevatech in 1977 and introduced first Pick and Place System at Nepcon West 1980. Bob is now the President, CEO and Co-Founder of Juki Automation Systems. He is also a Co-Founder of the SMEMA Council of IPC. He serves as a member of SMTA and SEMI..
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