| Sponsor |
|
5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
|
|
| Ask the Experts |
|
|
March 11, 2007 - Updated
July 4, 2007 - Originally Posted
Rigid and flex board assembly
We have some boards disconnected in transition zone: between rigid and flex segments. This happens during an assembly process. What is recommended to add to manufacture process in order to strengthen the area?
Anna Seredovaya
|
| Expert Panel Responses |
It seems like you are stating that you are having tearing of the flex circuit at the interface with the rigid board? And this is happening during manufacturing? During reflow, handling, or testing?
It would seem that this problem could be handled quite simply by ensuring good carrier design. Is there more to this that I'm missing?
Feel free to contact me directly with more details.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
