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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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Storage Solutions – Free Online Demo
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Essegi Automation
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| Ask the Experts |
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March 11, 2007 - Updated
July 4, 2007 - Originally Posted
Rigid and flex board assembly
We have some boards disconnected in transition zone: between rigid and flex segments. This happens during an assembly process. What is recommended to add to manufacture process in order to strengthen the area?
Anna Seredovaya
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| Expert Panel Responses |
It seems like you are stating that you are having tearing of the flex circuit at the interface with the rigid board? And this is happening during manufacturing? During reflow, handling, or testing?
It would seem that this problem could be handled quite simply by ensuring good carrier design. Is there more to this that I'm missing?
Feel free to contact me directly with more details.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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Reinforce Critical Components on PCBs
Low modulus wire tacking & ruggedizing adhesives hold vital BGAs & VGAs in place, enhancing shock & vibration resistance of electronic assemblies.
Dymax
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