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Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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| Ask the Experts |
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April 30, 2007 - Updated
July 4, 2007 - Originally Posted
Through-hole ratios for PCB's
In Through Hole technology, what is the best lead to hole ratio to be maintained?
Is the lead to hole ratio the same for any kind of PCB finishes or does it vary? What should be the pad size on the primary side and secondary side?
M.K.
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| Expert Panel Responses |
We ran some recent tests and reported at APEX 06 "Lead Free Intrusive Reflow" by Coleman and Oxx. In this study 1:1.3 and 1:1.4 provided good results while greater than 1:1.5 gave voids or insufficient fill.
I don't have information on Wave Solder process.
Bill Coleman
Vice President Technology
Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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