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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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| Ask the Experts |
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May 21, 2007 - Updated
July 4, 2007 - Originally Posted
Socketed IC's
Our company likes to install socketed IC's to make testing and repairs easier. Unfortunately, we have trouble with IC's coming loose from the sockets in finished products. There seem to be thousands of different DIP socket options available.
Can you recommend a "good, better, best" list of socket features?
J.W.
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| Expert Panel Responses |
Insertion and retention force should be specified. You should also control the spring material to make sure that stress relaxation is minimized or eliminated for your use environment.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
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