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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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| Ask the Experts |
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May 21, 2007 - Updated
July 4, 2007 - Originally Posted
Socketed IC's
Our company likes to install socketed IC's to make testing and repairs easier. Unfortunately, we have trouble with IC's coming loose from the sockets in finished products. There seem to be thousands of different DIP socket options available.
Can you recommend a "good, better, best" list of socket features?
J.W.
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| Expert Panel Responses |
Insertion and retention force should be specified. You should also control the spring material to make sure that stress relaxation is minimized or eliminated for your use environment.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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