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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
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| Ask the Experts |
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May 21, 2007 - Updated
July 4, 2007 - Originally Posted
Lead-free soldering term?
Can anyone tell me what the definition of a "Hot Tear" is when referring to the soldering process using Lead Free Solder?
Michelle Elston
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| Expert Panel Responses |
A crack in the solder joint formed by the metal pulling itself apart while cooling in the joint or a short time after its removal from the heat source. The defect is called hot tear when fracture takes place around or just after solidification of the metal. It may be known as a shrinkage or contraction crack.
Terry Jeglum
President/CEO
Electronic Technology Corporation
Mr. Jeglum has 35+ years experience and is the founder of Electronic Technology Corporation. He is responsible for 22 years of program management for the Company.
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Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
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