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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 5, 2012

Francois Monette, Co-President Sales and Marketing, Cogiscan, Inc.

Despite the overall economic challenges, Finetech had a very successful 2011. Our solutions for the most challenging rework of densely populated PCBs continue to address that need. We saw demand in POP, 01005 and QFN rework solutions. We are now nearing the 3rd year of our acquisition of Martin GmbH. The Martin products have become well known in the areas of BGA reballing and economical repair of game board, LED and mobile devices.


To help meet this growing demand we added to our application and support team in 2011.  We see Finetech and Martin continuing its growth as traditional SMT products merge more closely with our Micro-Assembly technologies in 2012. Our unique modular approach has always given customers the option to work with multiple technologies on one platform.  With companies trying to do more with less, Finetech is positioned to address that need across the SMT, Optoelectronic, MEMS, Nano and other markets.

Francois Monette
Co-President Sales and Marketing, Cogiscan, Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling