circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 6, 2012

Dr. Ahmad Hamadeh, President, H&T Global Circuits / Elreha

The opportunity to grow our business in 2012 is really no different than it has always been. Performance remains the key to our company's strength and growth. We remain committed to providing superior support and value to our customers by delivering world-class PCB fabrication supply chain services and products.


Having spent the last several years investing in our infrastructure in mainland China, Hong Kong and the U.S. in 2012, we will focus on expanding our geographic market coverage


While there is certainly potential for serious macroeconomic setbacks, we expect 2012 to be a stable year for the industry with small but steady growth. 2011 has been a good year for most of our customers and many of them have wisely invested in their operations this year, improving both capacity and capability in expectations of continued economic recovery.


That being said, we see our customers being very careful not to over-extend themselves, keeping hiring to a minimum and inventories low. P. D. Circuits will continue to provide the flexibility and value that our customers need to succeed in this challenging environment.

Dr. Ahmad Hamadeh President
President, H&T Global Circuits / Elreha
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling