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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 6, 2012

W. Scott Fillebrown, President & CEO, ACD

Looking toward 2012 and beyond, we see an elimination of the "middle man" with more companies selling directly to customers. We predict that more Asian companies will vie to establish presence in the western markets by purchasing operations in North America and Europe, allowing them to directly service their customers both locally as well as globally utilizing their internal sales and external reps.



With manufacturing operation in the U.S., Europe and Asia, this is certainly my company's strategic direction both today and in the future. We look forward to continually gaining a complete understanding of our customers' needs and not only meeting, but exceeding those needs. We look at 2012 as being the year of the true partnership; partnerships with our customers, our vendors and of course our sales representatives.

W. Scott Fillebrown
President & CEO, ACD
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling