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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 9, 2012

NK Chari, Marketing Director, Agilent Technologies

ACD will be leveraging its 18 months of investing in the infrastructure to make 2011 a great year. We are taking a two prong approach in expanding our product offering.



First, we have just finished installing two high-speed Juki lines in our Richardson facility. This upgrade allows ACD to answer the call for any domestic production volume. Each of our new lines are capable of placing 140,000 placements per hour.



Secondly, in addition to our quick-turn prototypes and domestic production, we now offer a low-cost international manufacturing option. Customers have requested this service and ACD has responded. For customers who have products that are price-sensitive, or have volumes that warrant off-shore capacity, ACD is responding with an approach that maintains the ACD quality at a lower cost point.

NK Chari
Marketing Director, Measurement Systems Division, Agilent Technologies
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling