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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 10, 2012

Jim Bernhard, President and Co-Founder, Quik-Tool, LLC.

2012 is expected to be a stable year for the electronics assembly industry. The business opportunities in BRIC countries will offset the slow recovery in Europe and America. In 2012, we will continuously lead the performance market by focusing more on application expertise and reducing cost of ownership.



Our convection reflow ovens provide ongoing cost savings through unparalleled uptime and the highest yields. We recently improved the system's productivity through improved flux management that extends maintenance cycles, and the with the Dual Lane Dual Speed option that essentially gives one oven the productivity of two. Looking forward, we will make our offerings more suited and flexible to different customer segments.

Jim Bernhard
President and Co-Founder, Quik-Tool, LLC.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling