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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 12, 2012

Stephen K. Brodeur, Program Director, Printer Division, Milara Inc.

The U.S. Presidential election and continuing gridlock in Washington may leave businesses cautious and tentative in expansion and capital investment. The manufacturing market in Mexico may be the exception. Labor rates in Mexico are on par with China. GDP in Mexico is expanding at double the USA rate. The exception may be the continued turf wars in the underground Mexican drug trade. This may be an impediment to foreign expansion of SMT factories (although that has not been evident at this time).



The main technical focus for 2012 will be improving yields and reducing secondary operations. This emphasis will be addressed with Automated 3-D Solder Paste inspection,  better PCB support through the SMT process, Track, Trace and Control implementation and process software automation; i.e. DFM, DFT, etc.

Stephen K. Brodeur
Program Director, Printer Division, Milara Incorporated
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling