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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 13, 2012

Mark Brawley, Vice President, Americas', Speedprint Technology

Milara has aligned itself to focus on product infusion to the market place in 2012.  While other companies scaled back operations this past year, Milara expanded to our new facility located in Milford, Massachusetts to offer our clients not only cutting-edge manufacturing of our printer products, but also class 100 cleanroom fabrication of our wafer robot handling product line.


Also, we have branched into the manufacturing of mask aligner systems for the semiconductor market and have committed all our systems to be produced here in the United States of America with the highest possible quality standards required for this sophisticated line of products.


In the advent of finer pitch printing capability (.3mm CSP and 01005 components), our inline printer products are ready to meet the demand and exceed the criteria.  This year we introduced our new Essentials inline product, which was well received at this past years' IPC APEX Expo. Our mission for 2012 is to get this product into the market where it is long overdue.

Mark Brawley
Vice President, Americas', Speedprint Technology
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling