The Indium Corporation will continue emphasizing materials innovation for 2012. Materials enable the incredible advances in electronics design and assembly - and materials have been our focus since 1934.
Our "From One Engineer To Another(R)" philosophy enables tremendous advances. Our staff continually learns about the requirements and aspirations of our customers; our customers learn about our ability and willingness to develop leading-edge materials solutions. This program will expand throughout 2012 as we invite PCB Assembly engineers to collaborate with our engineers.
We will continue working toward breakthroughs in cutting-edge equipment that uses our materials, enhancing the quality of the copper pillar process, improving thermal performance, and creating oxide powders for the next generation of 3D flat panel monitors. Particular emphasis will be placed on new product development, seminars, researching and authoring technical papers,participating in technical conferences, and customer site visits.
We will emphasize innovative products and process techniques, including: PIP+(pin in-paste PLUS), probe-testable solder pastes, BGA Metal TIM processes,3D Packaging Fluxes, and many more. These efforts result in improved probe-testability, reduced waste, increased first-pass yields, increased through-put, and more - exactly what our customers are requesting.
