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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 18, 2012

Sven Wedekin, Vice President / General Manager, GPD Global

Nordson DAGE have just introduced the revolutionary X-Plane(TM) technology into their XD7600NT Diamond FP and XD7600NT Ruby FP X-ray Inspection Systems, so we will be hard at work rolling this out across the rest of the world in early 2012.


From the customer reaction so far, the market will accept this new product very quickly, both at the PCBA and semiconductor level. We are confident that X-Plane will be the "talking point" within our industry in 2012 and will provide a great platform for the further growth of Nordson DAGE X-ray systems into 2012 and beyond.

 
Sven Wedekin
Vice President / General Manager, GPD Global
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling