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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 19, 2012

Stan Renals, CEO Cobar Division (Balver Zinn Group), Cobar Europe BV

2011 has been a great year for Etek Europe. Business has been tough, especially during the summer months, but it has been a great time to hire additional staff. Etek Europe has seen an average growth of 32 percent across our various divisions.

Both our UK & Eastern European customers seem poised for another year of growth, which will result in investing in new equipment. With more than 1000 customers, Etek Europe is firmly established in the automotive, aerospace, medical, and defense sectors of electronics manufacturing.



Etek Europe will introduce some additional divisions to our product portfolio in 2012. Our latest division that was launched during Productronica, Consumables & Production, has already allowed us to hire four additional staff.  Also, Etek has plans to open a presence in Germany in Q1, 2012.



As we increase our headcount in 2012, we also will bring on some new product lines including pick-and-place and a refurbishment division. We also have plans to move into a new custom built building in Q1, allowing us to have a new larger demo room, increased warehousing and office area, and a dedicated training room.

Stan Renals
CEO Cobar Division (Balver Zinn Group), Cobar Europe BV
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling