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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 20, 2012

Stephan H. Schmidt, President, LPKF Laser & Electronics North America

The outlook for 2012 appears to be weak in Europe and is dependent on the eventual outcome of the European banking crisis, however, in the Balver Zinn Group we continue to remain optimistic and will continue to launch new products into the market place to suit customer applications. Our growth in the Americas' and South East Asia is gaining momentum and continues to exceed expectations.


With the opening of the new Balver Zinn Singapore sales office and warehouse facility we will serve as a distribution center for Balver Zinn and Cobar products in Singapore, Indonesia, Malaysia, Thailand, Philippines, Vietnam, South Korea, Australia and India.


Our investment in new people and new technology even through bad economic times is in the only way to succeed and grow into the future, and the Balver Zinn Group will continue to look at new solutions to help our customers meet their goals.

Stephan H. Schmidt
President, LPKF Laser & Electronics North America
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling