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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 24, 2012

Robert Boguski, President, Datest

We see a great opportunity for Essemtec in 2012. 2011 has been one of our best years regarding turnover. We have been able to grow strongly in many regions. Especially in the USA we were able to exceptionally increase our market share. Existing and new customers have faith in us and our solutions. Our order books are full. This clearly shows that we are on the right track and that we have developed the right products for our customers.


As we move into 2012, we see growth, both from our existing customer base as well as new accounts from our sales staff's business development efforts. One important point is that we never stand still; we always continue to further develop our products to meet our customers' future challenges.


In the end of 2012 we will experience an Essemtec which will be even more efficient in many ways and which has aligned itself even more to the needs of customers. Essemtec will present itself leaner and will be able to react more flexible. We will also gain market share in the segment of faster machines.

Robert Boguski
President, Datest
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling