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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 25, 2012

Jeff Timms, Head, SIPLACE Americas

2011 was a very positive year for OK International. We saw growth over all products and key regions. The pace of the market did slow through Q4 2011, but we were still able to exceed plan. I attribute the latter to delivering critical time to market solutions that have become part of numerous leading global EMS providers. As we look to our market spaces in 2012, we are predicting for another solid year.



We would expect Q1 to take on the same business level as Q4, but post Chinese Lunar New Year and financial market stabilization in the EU, we expect a steeper growth curve Q2-Q4. We are very excited for 2012, as we will have formal production release of a new array package rework machine called "Scorpion." Thus far the Scorpion has received highly positive market feedback globally, which is largely due to a very balanced value proposition. We look forward to 2012.

Jeff Timms
Head, SIPLACE Americas
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling