circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 26, 2012

Julian Coates, Business Development Director, Mentor Graphics

With the SIPLACE SX we currently offer the world's only placement platform whose flexible gantries allow the manufacturer to scale its performance depending on his current business volume. Against the backdrop of economic uncertainty in 2012, these capacity-on-demand features and the capabilities of our SIPLACE software are becoming even more important for our customers.



With our ability to flexibly combine hardware, software and services we address our customers' specific challenges and provide the best possible support for their NPI, changeover and production run processes. Something our customers will certainly focus on: "Simplify" -- because only lean solutions can be truly flexible.


Where other equipment manufacturers require different placement heads and waste lots of time for head changes, SIPLACE needs only the single MultiStar placement head that changes its placement mode in response to software commands.


Instead of complex user interfaces, we offer the SIPLACE SmartGUI: one intelligent interface that uses fault localization capabilities, instructions and videos to help operators restart the line quickly after something has gone wrong. And our hot-swappable SIPLACE X-feeders register themselves and their components automatically with the line and feature LED signals to indicate when they can be removed again.



In 2012, electronics manufacturers in the Americas and all over the world will require even more flexibility due to volatile demand, fast product changeovers and product diversity, to name just a few factors. SIPLACE provides the most efficient solutions for these requirements.

Julian Coates
Business Development Director, Valor Division Mentor Graphics
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling