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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 26, 2012

Frank Hart, Global Sales and Marketing Manager, PVA

The drive to accelerate the development and launch of new electronic products into volume production is relentless. During next year Mentor Graphics will be releasing upgraded solutions that focus on New Product Introduction to help designers and manufacturers achieve a faster transition from design to volume production.


To achieve real performance improvement a combined approach comprising software tools, intelligent data exchange formats and consistent technical support across the supply chain will be included. Just a point-tools approach or a data format taken in isolation is not enough -- a complete solution that works across networks of design and outsourced manufacturing companies is required, even when multiple tools-vendors are involved.


During 2012 we will be expanding the scope of the ODB++ design-to-manufacturing exchange format and increasing access to it for all members of the industry - customers, partners and our colleagues in the CAD/CAM software tools business. The format has been in a process of adoption and evolution for over 15 years now; achieving the position of "de facto" standard.


During 2012 we intend to build on that further now that ODB++ has also  been adopted as the foundation for Mentor's recommended best-practice design-to-manufacturing solution. A significant investment has been made in ODB++ implementation by the industry during the last decade. Now we at Mentor Graphics see the opportunity for further improvements for designers and manufacturers without making any disruptive changes involving alternative methods.


In summary, we expect to see evolutionary improvements in the CAD/CAM integration market -- more value built on investments that have already been made during recent years

Frank Hart
Global Sales and Marketing Manager, PVA
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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