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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 27, 2012

David Suihkonen, President, R&D Technical Services

Techcon Systems saw a very fast start to the year with activity levels slowing down slightly in September before picking back up in December. Growth remained strong in 2011, hitting double digit growth for the second straight year fueled by industry growth and market share gains.



In 2012, we expect the growth to continue in the double digits but with a slightly slower start to the year with revenues ramping back up to higher levels, in Q2.



There is a little uncertainly in the global market in 2012 heading into Q1, however, we remain optimistic that we will be able to sustain our growth trends for the year. We continue to build our business using the strength of quality products and our unsurpassed support, both in applications and customer service. Additionally, we will continue to focus on market expansion and new product development.



Currently, we are preparing to hire additional Regional Sales Managers for Europe and Asia in 2012. We also have been working on several projects that include the development of new valves, pumps and custom dispensing systems that will be introduced to the market in 2012. In the operations department, we are adding additional staff and strengthening processes to support our growth.



The Techcon team is very excited to move into the new year and is optimistic in achieving our growth targets in 2012.

David Suihkonen
President, R&D Technical Services, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling