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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 31, 2012

Michael Brianda, President, DEK

After a yet another record year in 2011, Kyzen expects 2012 to be full of challenges in the packaging world. The combination of an uncertain economic outlook and a significant shift toward 3-D packaging will create many opportunities. The technology shift will certainly make cleaning more demanding, and those increased technical demands only highlight the value that our award-winning products deliver for our customers.


During uncertain times, customers often have more opportunity to evaluate the value delivered by the key suppliers and consider alternatives where their value chain can be improved. Kyzen's commitment to customer service, which also has been recognized by industry awards, tends to stand out.


Kyzen's name means continuous improvement, or by another name innovation. Over the past
20 years, Kyzen's cleaning technology has indeed continuously improved to meet the ever-changing, and almost always more technically demanding needs of our customers. Kyzen's dedicated sales team is based in nine different countries around the world.


This footprint is unmatched in the industry and allows us to spend time one-on-one with our customers to better understand their emerging needs Our R&D group is busy; and armed with that direct feedback from our customers, they are hard at work on several new innovations that will be introduced in 2012.

Michael Brianda
President, DEK
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling