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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 2, 2012

Don Naugler, President, VJ Electronix, Inc.

BPM Microsystems benefited from the device programming industry expansion in 2011 by having the right product for the market requirements. Going forward we anticipate the industry will continue to adopt our 8th Generation universal technology, particularly for Flash Memory and Microcontrollers.



Customers appreciate the 8th Gen flexibility, unbeatable performance and cost of ownership. We continue to see new
applications for our core technology. With our increased manufacturing capability, planned product offering improvements and new products, we expect expansion into new markets in 2012.



The increasing demand for programmable devices drives us forward, so we are optimistic that 2012 will be another good year. Now starting our 27th year, BPM Microsystems' strategy for product development is based on customer needs today, and a vision for what their needs will be in the future.

Don Naugler
President, VJ Electronix, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling