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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 2, 2012

Michael Konrad, President, Aqueous Technologies

2012 promises to be another exciting year. Our customers are cautiously optimistic and speak of plans for strategic investment and growth. One area of growth that has continued to have a great deal of our attention has been around consumer electronics.



Smartphones and tablets lead the technology curve.  More technology is being crammed into smaller form factors. Reduced lead pitch, Package on Package, and micro passive devices present some difficult challenges for both rework and inspection.



These items have carried much of our R&D focus in 2011 and have yielded some innovative new products and solutions. We will continue to evolve and enhance these solutions through 2012 and beyond.



Another demand from the consumer oriented production is cost effectiveness. Our goal will be to offer more than cost effective equipment options. We will be expanding our support both technology wise and geographically. We want to be close to our customers. We will be adding staff and support partners into growing areas such as Southern and Western China and Eastern Europe.

Michael Konrad
President, Aqueous Technologies
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling