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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 3, 2012

James Quinn, Vice President Global Sales & Marketing, Multitest

2011 witnessed a record year at Aqueous Technologies and we expect our growth to continue during 2012.



Aqueous Technologies hired several new staff positions during 2011 and we expect to continue our team building into 2012, with the expectation of added service, sales, and production positions.




2011 brought one of the most significant advances to cleaning systems. With the introduction of the Trident XLD, users were able to remove any type of flux residues from any alloy without sending any effluent to the drain.



At APEX 2012, we will introduce the newest cleaning technology, a truly revolutionary new high volume defluxing system unlike any current cleaning system available today.



Overall, I expect measurable growth in the electronic assembly industry in North America and Asia and more modest growth within Europe.

James Quinn
Vice President Global Sales & Marketing, Multitest
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling