For Nihon Superior 2012 is going to be a year for introducing innovative products as we face the challenges created by the current uncertainty in the global economy.
The innovation will come in the form of solutions for substrates that are difficult to solder and for products that are difficult to solder lead-free. Specifically we will be offering alloys and fluxes for soldering to aluminum, high temperature lead-free solder paste for void-free vacuum reflow of power devices where heat transfer is important, and Sn-Zn solder paste.
Nihon Superior will also be extending the range of, and aggressively promoting two important product categories, the SN100C Advantage Series and totally halogen-free flux technologies. The SN100C Advantage Series(R) builds on the more than 12 year track record of reliability of lead-free solder SN100C with enhanced performance in particular applications.
A particular driving force for innovation is the need to improve the efficiency of electricity reticulation through the introduction of "smart grids".
