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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

February 7, 2012

John Perrotta, Vice President, Europlacer North America

Microscan expects the extremely high growth trends of 2010 and 2011 to soften slightly in 2012, but is still planning on a strong growth year in 2012. In the past year, we have introduced the award-winning AutoVISION(TM) smart camera product line. The AutoVISION products enable traceability and quality control in the electronics
industry.

In 2012, Microscan plans to continue to add capabilities to this product suite and configure the AutoVISION barcode and machine vision ability for the electronics industry. In 2011, we created a cross functional, global team focused on solutions for the electronics industry, and in 2012 we will be adding (hiring) several new members to that team.

At Microscan, we believe in the long-term growth prospects for electronics in all regions of the world and will continue to provide industry leading support and add members to our global customer service team.

John Perrotta
Vice President, Europlacer North America

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura