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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 7, 2012

Markus Wilkens, President, ASYS Group

Europlacer North America had a very strong year in 2011, with a 50% revenue increase in sales over 2010. With market conditions expected to improve next year, Europlacer North America is forecasting another growth year for 2012 and the company is well positioned to gain further market share.



"As we meet with new companies throughout North America, we find engineers and business owners are excited about our unique technology and service capabilities," said John Perrotta, VP of Europlacer North America. "Using Europlacer technology, our customers are uniquely positioned to meet and even exceed tighter demands without making huge capital outlays for new capacity.



At Apex 2012, Europlacer will introduce new tools that increase SMT productivity and expand upon its existing pick and place platform. The company will continue to develop assembly tools designed specifically for high-mix efficiency as demands upon North American EMS companies and OEMs continue to grow.



To support our increased sales in North America, we added several new staff members in 2011, including two customer service employees and a national sales manager. As we penetrate new local markets and generate more sales, we plan to add more employees to the Europlacer North America team in 2012.



Markus Wilkens
President, ASYS Group
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling