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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 8, 2012

Carsten Salewski, President / CEO, Viscom, Inc.

Finishing off 2011 with the strongest order back log ever, we are confidently looking forward to a promising 2012. We have seen a lot of European EMS providers establish their facilities in the Americas in 2011 - and there are quite a few more expansion plans around the corner.



It is also encouraging to see that a lot of the new investments are actually being made here in the US, and unlike in the past primarily in Mexico. With a strong product portfolio and truly innovative additions in all market segments, Handling, Marking, Routing, Printing and Final Assembly, which will be introduced at APEX in San Diego, we predict this year to meet or even exceed pre-2009 levels.



We experience a lot of interest in our new SIMPLEX(R) HMI for the EKRA printers, which is easy and intuitive to use - significantly reducing set-up times, and we will continue its implementation across our other product segments. Even some of our VEGO Dynamic Handling equipment will be equipped with color touch panels to ease the set up and programming off more advanced system features like maintenance logging or MES interfaces.



With new product releases in 2012 for the DIVISO Router family and the INSIGNUM Laser Marker family we are ready to offer the perfect equipment solution to meet vast requirements -- from NPI to mass production.

Carsten Salewski
President / CEO, Viscom, Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling