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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 8, 2012

Mike Scimeca, President, FCT Assembly

We are carefully optimistic and believe that business will continue in 2012 the same way that made 2011 so successful for Viscom -- very strong business in Europe, growth in Asia and surprisingly high demand in North America.



Our complete product line, with the highest performance at every test gate (SPI, AOI and AXI) and a strong customer base in high-quality automotive and industrial electronics as well as high-end EMS, is the foundation of our success.


In 2012, we will continue to launch new products and ground-breaking technologies. Also, we will continue to win new customers with our not only award-winning, but proven technology that truly produces the best inspection results.



Our founders, Dr. Martin Heuser and Volker Pape, who conservatively manage the company with a strong focus on innovation, head Viscom group's board. With a great team of excellent engineers and experts as well as an exceptionally strong financial background, we are well prepared to master the challenges that 2012 will present.

Mike Scimeca
President, FCT Assembly
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling