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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 9, 2012

Michelle Ogihara, Senior Sales Manager, Seika Machinery, Inc.

FCT Assembly is gearing up for 2012 with the introduction of new equipment, new employees, expansion into new markets and a focus on our unique products and services that have yielded excellent results in 2011.



Our solder division is excited to welcome a new SMT line to our Greeley, CO headquarters. The equipment will facilitate the growth of our R&D efforts and help provide the necessary support for our customers. We also welcome a new team member to FCT Asia, Eugene Tan. We are confident in his ability to grow and anticipate that his knowledge will allow us to expand into new markets.



Fine Line Stencil experienced tremendous growth in 2011 and with that we have purchased a new LPKF laser that will be operational in January. We also have hired new CAD personnel to keep up with the growing demand.



We are looking forward to a year filled with growth and opportunity in 2012!

Michelle Ogihara
Senior Sales Manager, Seika Machinery, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling