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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 9, 2012

David E. Raby, President/CEO, STI Electronics, Inc.

On behalf of Seika Machinery, I would like to wish all of our industry colleagues a very happy, productive and prosperous 2012. We remain committed to providing high-quality, competitively priced SMT solutions to our customers not only from Japan, but also from other valued resource locations.



As a multi-national trading company, we procure proven and successful global supplier equipment and materials with full sales and technical support provided by our team based in our Los Angeles and Atlanta offices.



In the last two years, we have introduced our popular green technology products, which include the Solder Paste Recycling System, the Paste Printer Wiper Roll Recycling/Cleaning System, and most recently, our low-VOC, energy-conserving Fully-Automatic Ultrasonic Stencil Cleaner. There are a number of other unique "green" equipment and materials that were introduced in a white paper presented at the last SMTAI in Fort Worth, Texas, that we also will look into procuring for our customer base.



We will be debuting new selective soldering systems and a conformal coating and curing system in 2012. New models of our popular McDry dry cabinets and Sayaka PCB routers also will be introduced.



In general, Seika Machinery will continue to introduce the latest cutting-edge technology products from the Pacific Rim and globally. Starting in 2010 and expanding into 2012, we will provide support to our North American based customers with facilities located in South America, EU and Asia through our extensive, dedicated sales and engineering network.


David E. Raby
President/CEO, STI Electronics, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling