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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 10, 2012

Kevin Laphen, President, Practical Components

As a business owner I have to say I am looking for good things to happen in 2012. The overall industry should continue to improve although slower than we would like. I do believe, however, we are headed in the right direction.  An expected decrease in military spending is a concern but growth on the commercial side should more than make up for it.


For STI, 2012 is the opportunity to continue to build on the foundation we have been putting in place for the past 29 years. We are better prepared than ever to provide our customers with solutions in design, manufacturing, and training. We continue to strive to be a partner on multiple levels through a customer's manufacturing cycle.


STI will be adding new products and services as well as one or more new quality certifications in the coming year.  We have some exciting expansion plans for 2012 that will be announced at appropriate times and on December 3, 2012, STI will celebrate its 30th year in business.



Kevin Laphen
President, Practical Components
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling