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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
February 10, 2012

Jon Hanson, Sales & Marketing Manager, Computrol, Inc.

In 2011 we saw an unprecedented surge in new high-technology products and we expect that trend to continue in 2012. After a couple of years of slow adoption of new fine-pitch technologies, we are seeing renewed interest in products such as the Amkor .3 mm pitch CVBGA and wafer level packages.


In 2011 we re-focused our efforts on some existing products such as training kits as well as cleaning test and conformal coating aids that have performed nicely.


Internationally, our distributors have fared unevenly depending on their particular country's situation. The developed economies continue to face risks that could dampen future growth while the U.S market, though not quite at pre-2007 strength, has seen vigorous expansion.


We have grown in several markets worldwide where we had little penetration in the past, including southern Europe and North Africa, but our largest increase has come from the U.S. markets and we expect that trend to continue.

Jon Hanson
Sales & Marketing Manager, Computrol, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling