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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 15, 2012

Shen Hwang Ting, Global Marketing Manager, CyberOptics Corporation

Digicom is going through a metamorphosis. It's a multi-angle, multi faceted approach to build better products. It includes enhancement in productivity, product control, quality control, and integrity of the product that's built. Our new, state-of-the art facility, that will be ready at the end of February, enhances our space allocation. New equipment has been purchased, processes developed, and volume manufacturing capabilities have increased.




There is a gap in the market caused by new technologies that make it more difficult to ensure circuit board integrity. With our Diamond Track Package we approach design, cleaning, manufacturing, quality, and reliability in a comprehensive new way and are closing the technology gap to deliver excellence



A major focus for 2012 is on board cleaning. Today's new chemistries in fluxes and solder, plus the closeness of components, make cleaning more difficult. After much research we developed a cleaning process that uses the latest equipment and also incorporates our scientifically focused method and testing to ensure the cleanest possible boards.




Medical device companies are encouraged to partner with us as our ISO 13485:2003 medical quality certification and validation processes help medical companies bring their products to market faster. Another major emphasis will be on helping companies eliminate factors in their design that could cause manufacturing and quality issues.


Shen Hwang Ting
Global Marketing Manager, CyberOptics Corporation
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling