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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 16, 2012

John Lewis, Market Development Manager, Cognex Corporation

For 2012 PROMATION will continue to focus on its core products, streamlining our offerings to what we do best. While our PCB and Pallet handling solution sales have remained steady, significant growth has been experienced with our robotic soldering
systems.


In 2011 PROMATION introduced PROFLEX, a new diode laser soldering platform that allows us to mount multiple heads into a single gantry, or attached a variety of features to a single end effector.


For 2012 PROMATION will roll out a new table top soldering system, the
TT Series. These desktop hot iron robots are design to compete head-on offering numerous standard features, high accuracy motion control, and "best in class" pricing.  We remain thankful to our existing customers for their continued support and look forward to serving many new customers in the future.



John Lewis
Market Development Manager, Cognex Corporation
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling