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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 20, 2012

Barbara Duvall, General Manager, SEICA S.p.A.

2012 will be a challenging year for the solar industry as it relates to electrically conductive adhesives and inks. However, our company remains very optimistic about the newly developed technologies we have been introducing. The major market for our newest materials is the building industry where our materials can be used by roofing manufacturers.



While Europe and the United States continue to slow in economic growth, China is maintaining a healthy growth pattern within the solar industry. We expect this to continue for many years. Our lower cost, electrically conductive adhesives and inks have been introduced at a very good time as the cost of silver continues to remain high.



ECM will continue to develop alternatives to high cost, silver electrically conductive adhesives and inks to meet the demand of the solar module manufacturer.

Barbara Duvall
General Manager, SEICA S.p.A.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling