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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 20, 2012

Saeed Taheri, President, Acculogic, Inc.

Seica has continued to grow in 2011, increasing sales by 30% with respect to 2010, our previous best year.


Our outlook is positive for 2012, and to ensure that we can continue to offer the highest level of technology and support to our customers we have planned a series of investments in people and infrastructure in addition to those in R&D, which are the foundation of our corporate strategy.



In 2012 we will be focusing particularly on automation, and we have recently added two new solutions: the Compact SL, a complete in-line system for in-circuit, functional and hybrid test, and the automated version of our Pilot V8 for operator free flying probe test.

Saeed Taheri
President, Acculogic, Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling