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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Rentals and Rent to Purchase x-ray Systems
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
February 22, 2012

Chetan Shah, President & CEO, Flex Interconnect Technologies

As we head into 2012, all of us at Juki are very optimistic about the year ahead. The beginning of 2012 marked our 25,000th machine sold worldwide since 1987. In 2011, we continued to see an increase in sales activity. We attribute much of this to our diversified product offerings and customer base.


We are pleased with the current level of business and find ourselves placing equipment in facilities that are looking to find ways to increase their productivity and lower their overall cost of ownership. Currently the company is working on innovative solutions to address the growing need for higher speed requirements without sacrificing the modular solution that Juki pioneered.



With the IPC APEX Expo fast approaching, we look forward to seeing our customers at the show. Juki will display new selective solder, LED and high-speed models aswell as new software solutions in the areas of factory floor management, programming,NPI, and traceability.



Juki is continuously adding new employees and sales representatives to enhance its service and support. We recently added new representatives to help us continue to build our number one position in the market. We also are expanding our engineering staff. Our philosophy is to have our service engineers within driving distance to all of our customers. This allows us to maintain a much more personal relationship with our customers in addition to better response times.



We are fortunate that our current sales activity puts us in a position to be adding resources, while many others still have to cut back.

Chetan Shah
President & CEO, Flex Interconnect Technologies
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling