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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 23, 2012

Ben Khoshnood, President, Zurvahn LLC

After a very good Productronica, which was exceptional both in terms of visitors to the EVS booth as well as positive requests for quotations and follow up visits.



EVS is very confident that customers' desire to save costs and improve processes will drive 2012 to new heights. We are happy with the current trading and feel that the west has turned the corner. We are getting many more enquiries and budgets areavailable for any improvements to aid cost reduction programs or process improvements.


EVS will announce at APEX significant savings in nitrogen, which is a huge cost to manufacturers and can be reduced by more than 50 percent.


EVS also will launch a new product in 2012. These announcements will be made during the course of the year.

Ben Khoshnood
President, Zurvahn LLC
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling