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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 2, 2013

Colin Longworth, Managing Director, DKL Metals Ltd.

ACD will continue to expand its national market in 2013. After receiving the AS9100 certification in 2012, we plan to further expand into the production side of the Military and Avionics business.


ACD has spent the last 12 months improving its manufacturing and revision control systems, giving us the capability of a Tier 1 EMS company. This combined with a personalized customer service model makes ACD the go-to company for high-end electronic assembly.


Also, we see ACD growing at a faster than industry pace due to the increase in quick-turn manufacturing and a higher demand for design services.

Colin Longworth
Managing Director, DKL Metals Ltd.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling