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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 3, 2013

Francois Monette, Co-President, Cogiscan Inc.

In the UK and Ireland 2012, was a difficult trading year with first half seeing consolidation, and in some key industries, some moderate growth from 2011 levels. The second half of the year, particularly Q4, has seen a significant drop in business levels and confidence across all manufacturing sectors with the automotive sector taking the biggest hit.


The current continuing economic woes in the Euro-zone do not help UK business confidence as Europe remains our largest trading partner; however, we remain hopeful that a positive solution to the current crisis in Europe will see demand recovering in the UK.

Despite our reservations, we look forward to the challenge of 2013 and hope that we at DKL can see continued growth across all product range.

Francois Monette
Co-President, Cogiscan Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
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