In 2013 Nihon Superior will be continuing its emphasis on innovation, widening the range of applications for which it can provide solutions.
Nihon Superior's commitment to scientific research is reflected in the establishment at the University of Queensland in Australia of the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) that will be developing new joining materials.
An addition to the SN100C family is "SN100C7A" solder for high temperature service in power modules.
Also new is the AlcoNano family of materials based on unique nano-silver technology. These lead-free materials make it possible to affect a connection at temperatures similar to those used in the reflow of high-lead soft solders, but the joint retains its high strength at much higher temperatures to provide the high thermal and electrical conductivity required in SiC diodes and power transistors.
For reflow soldering, SN100C P810 D4 is a new lead-free solder paste developed to deliver minimum voiding, particularly in vacuum reflow. The SN100C P604 D4 lead-free and completely halogen-free solder paste meets the requirements of the EU REACH legislation while delivering excellent performance in printing and reflow and reliability in service.
