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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 9, 2013

Doug Dixon, Global Marketing Director, Henkel Electronics

As we come to the end of another tough year, I try thinking back to capture those distant memories of when business was not tough but I fail!



So what can we take from 2012 into the next year and beyond? Well despite all the bad press the world of commerce is still turning, people are still buying stuff; others are making the stuff and buying stuff to make the stuff with. Maybe not as much and maybe being more selective, but they are still buying.


I believe the move to buy equipment for value and not price will continue and grow. When you are spending a lot of money in this day and age, whether it is a car or a pick-and-place machine, you look beyond the price. How long will it last, how reliable will it be, what are the real running costs, will it do what I want in three years' time?



Nordson DAGE will continue to maintain its position as a technology leader and we are recruiting and increasing our R&D spend to secure this position. We have some exciting plans for 2013 and hope to increase our satisfied customer base significantly.

Doug Dixon
Global Marketing Director, Henkel Electronic Materials LLC
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
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