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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 14, 2013

David Lesperance, General Manager, Vitronics Soltec

While we have had a number of challenges with the global economy in the recent years, we have a basis for optimism going forward. Consumer electronics are again the most wished for gifts this holiday season. Innovation in tablets and smartphones is driving much of that interest, and to the delight of the consumer the product they buy this year will have more functionality and cost less than last year.



At BTU we are focused on bringing our customers more value in 2013. We recognize that as our customers' product ASPs decline, the pressure on cost reduction increases. We are adding a new reflow platform to our portfolio, the DYNAMO(TM).



The DYNAMO is designed specifically for portable electronics manufacturers where the pressure for cost reduction has been acute. The DYNAMO features an innovative convection system simplifying the oven design and delivering the reliability and performance that BTU is known for. DYNAMO will be available worldwide in Q1 2013.



Our award-winning PYRAMAX(TM) reflow oven will continue to satisfy our customers in market segments where process conditions are more challenging, such as semiconductor packaging, military, or industrials. The PYRAMAX has long been the industry benchmark for performance and you would be hard-pressed to find an application that it cannot do.




We are going to continue to improve the PYRAMAX and plan to keep it the best performing oven for years to come. In fact, this year we are launching an upgrade program allowing our existing PYRAMAX customers to save operating costs and enhance productivity.

David Lesperance
General Manager, Vitronics Soltec
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
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Affordable Profiling