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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 22, 2013

Gary Stoffer, Vice President Sales and Marketing, OK International

Our market expectations for 2013 are positive. After the consolidation phase we expect an increase in growth. Especially the LED Lighting market will increase, where a high demand for flexible, efficient and high quality production equipment can be expected.




Essemtec's dispensers, for example, create phosphor lenses with the highest accuracy and speed. Pick-and-place machines safely insert LEDs at high throughput and sophisticated reflow ovens make sure that LEDs are properly soldered while keeping the thermal load low for the LED.



3D-MID is another market with a promising growth potential. LDS (Laser Direct Structuring) has been developed by LPKF to enable economical production of 3D-MID in small series. This has given these applications a push. Essemtec now has introduced the Hydra, the first flexible 3D assembly machine. It is the first standard 3D placement machine and will therefore reduce production cost.



In 2013, integrated production will become more popular for small electronics series and traceability becomes an issue for small scale productions and prototyping. Manufacturers will want to take advantage of the savings potential of the integration of machine and ERP software. Of course, such models are only possible with a holistic approach. Production equipment, storage systems, management software, know-how, the link between all machine, ERPs and other software solutions plus the support must be from a single source. This is exactly the aim of Essemtec's machine and software solutions.

Gary Stoffer
Vice President Sales and Marketing, Electronic Assembly Products Group, OK International
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling