circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 22, 2013

Michael Hanke, Chief Customer Officer, Rehm Thermal Systems

We typically watch the trends of IC units as a leading indicator of our electronics business. The latter data is showing modest IC unit growth in 2013. Beyond that, we look to new product introduction and growth in emerging markets to grow share. 2013 is positioning to be an exciting year for us as we are poised for several new product introductions.



The latter product additions will be in hand soldering as well as our convection business. We look forward to reach even greater heights with our new advanced package rework unit called Scorpion. Since the introduction of the Scorpion earlier in 2012, we have truly caught the attention of leading EMS providers. 




The Scorpion has been able to handle all the component rework demands that their leading edge smartphones and tablets demand.  Based on the backlog of Scorpion orders, we feel we have really created the ideal value proposition for the customer.




At the root of all we do is our team. We have made several additions to our staff, including strengthening our operations team to ensure the time to market demand of our customers is exceeded. We look forward to 2013 and taking the next steps forward with our customers.

Michael Hanke
Chief Customer Officer, Rehm Thermal Systems
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling