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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 23, 2013

Carsten Salewski, President / CEO, Viscom Inc.

The electronics industry was once somewhat immune to macro-economic factors, but those times are long past. Operating from a European headquarters, we are keenly aware of the challenges facing the electronics market there, and will be very surprised if there is any improvement before the second half of 2013.


On the other hand, we conclude from discussions with other customers that Asia will be much more stable, with renewed growth opportunities...however modest by historical standards. In North America, continued discussion about on shoring and an economy freed from election paralysis offers additional promise of growth.


Rehm will launch a variety of new products in 2013, many with an intense design focus upon ultra low energy consumption, in addition to process innovations tailored for the specific demands of different worldwide markets. We have also continued to invest in our local infrastructure, and will open a new building in 2013 on our German campus which includes a state-of -the-art applications laboratory and demonstration center.


The grand opening and dedication ceremony will coincide with our June 6-7 Technology Days. This annual event spotlights Rehm's ongoing commitment to delivering more than simply hardware...but also the process knowledge essential to success in a competitive global marketplace.

   
Carsten Salewsk
President / CEO, Viscom Inc.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling