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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 23, 2013

Brian D'Amico, President, MIRTEC Corp

The outlook for North America continues to be promising with a continuously strong automotive market, increased on-shoring and small businesses adding capacity. Despite the financial crisis Europe has been a strong market for Viscom in 2012 and will continue to be very important in 2013.


Our customers in Asia show some exciting activities as well, which leads us to believe that we will see some growth. Viscom's new developments will strengthen existing customer relationships and help us gain market share with state-of-the-art affordable technology in SPI, AOI and AXI.


Product launches like our new AOI camera module that cuts inspection time in half, as well as new AXI technology and new software releases, complete our already comprehensive product line. We at Viscom look forward to an exciting and successful new year in 2013.

Brian D'Amico
President, MIRTEC Corp
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling