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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 24, 2013

Markus Walter, CEO, SEHO Systems GmbH

MIRTEC continues to not only push, but "redefine" the envelope for technological advancements within the Electronics Inspection Industry. Without doubt, MIRTEC will adhere to its aggressive technology roadmap in 2013 and beyond.


We will be introducing new products which will allow us to capitalize on opportunities in other complementary inspection markets. At this point, I would rather not disclose our marketing plans, but suffice it to say, there are some very exciting projects under way.


MIRTEC invested heavily in human resources throughout 2011 and 2012. That being said, there are still some key positions which we are looking to fill in the upcoming year.


Due to global economic uncertainty, I believe that our industry should expect the same slow and steady growth throughout 2013 that we experienced in 2011 and 2012.

 
Markus Walter
CEO, SEHO Systems GmbH
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling